Advanced laser solutions for interconnect and component production.




Turn-key systems for the electronic component market meet a broad range of applications:

  • via drilling
  • flex circuit processing
  • resistor trim and test
Laser PCB Drilling, Trimming and Cutting Systems
Laser PCB Drilling, Trimming and Cutting Systems

ProVia™ Drilling & Cutting Systems

ProVia systems are advanced volume production workstations for rigid, rigid-flex or flex panels, incorporating high performance beam positioning and laser control for high throughput drilling and routing of complex features.


Choose from Dual-laser (UV + CO2), UV, and CO2 lasers models

  • Single-laser systems available in dual-head, dual-panel processing configurations
  • All systems are roll-to-roll compatible
  • Standard or compact automation available


CO2 laser systems are appropriate for high speed drilling, cutting and skiving of dielectrics, while UV laser systems are able to drill and pattern copper and can provide higher process quality in many dielectrics.  Whether your application is with glass or organic reinforced epoxies or non-reinforced materials (resin-coated foil or polyimide), there is a ProVia model to meet your requirements.


ProVia FP-UC

Dual-laser (UV + CO2) laser drilling system providing the broadest capability with optimum speed.



ProVia FP-C

High repetition rate, high peak power CO2 laser system for drilling and cutting dielectric material.



ProVia FP-U

High power UV laser for superior drilling and cutting quality.



RapiTrim™ Laser Trimming Systems

RapiTrim systems enable both quick-turn and volume production resistor trimming for advanced hybrid circuits and electronic components.


Standard models incorporating PPI's proprietary high-speed flying probe technology eliminate traditional probe cards and their inherent limitations, providing many advantages:

  • Circuits can be as large as the substrate itself
  • Probing of dense designs is effortless - previously required multiple passes with multiple probe cards
  • Four independent flying probes - any component location, size, orientation and layout can be accommodated
  • Net throughput higher than probe card solutions that require long probe stepping times


Turnkey solutions for active trim applications and specialized component handling and fixturing are available.


IR (1064nm), Green (532nm) and UV (355nm) laser models available.



Designed for hybrid circuits and component production.




Large format system for full-size PCB panels.




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