Turn-key systems for the electronic component market meet a broad range of applications:
ProVia™ Drilling & Cutting Systems
ProVia systems are advanced volume production workstations for rigid, rigid-flex or flex panels, incorporating high performance beam positioning and laser control for high throughput drilling and routing of complex features.
Choose from Dual-laser (UV + CO2), UV, and CO2 lasers models
CO2 laser systems are appropriate for high speed drilling, cutting and skiving of dielectrics, while UV laser systems are able to drill and pattern copper and can provide higher process quality in many dielectrics. Whether your application is with glass or organic reinforced epoxies or non-reinforced materials (resin-coated foil or polyimide), there is a ProVia model to meet your requirements.
Dual-laser (UV + CO2) laser drilling system providing the broadest capability with optimum speed.
High repetition rate, high peak power CO2 laser system for drilling and cutting dielectric material.
High power UV laser for superior drilling and cutting quality.
RapiTrim™ Laser Trimming Systems
RapiTrim systems enable both quick-turn and volume production resistor trimming for advanced hybrid circuits and electronic components.
Standard models incorporating PPI's proprietary high-speed flying probe technology eliminate traditional probe cards and their inherent limitations, providing many advantages:
Turnkey solutions for active trim applications and specialized component handling and fixturing are available.
IR (1064nm), Green (532nm) and UV (355nm) laser models available.
Designed for hybrid circuits and component production.
Large format system for full-size PCB panels.